Reliability aspects of electronic devices for advanced requirements

dc.contributor.authorSchuessler, Florian
dc.contributor.authorRösch, Michael
dc.contributor.authorHörber, Johannes
dc.contributor.authorFeldmann, Klaus
dc.date.accessioned2013-01-29
dc.date.available2023-10-16T13:55:04Z
dc.date.created2008
dc.date.issued2013-01-29
dc.description.abstractPurpose – This paper aims to detail the qualification of alternative substrate materials and reliability aspects for quad flat no lead (QFN) packages for highly stressed electronic devices, e.g. for use in automotive applications. Design/methodology/approach – Detailed information is given on the advanced climatic and mechanical requirements that electronic devices have to withstand during life cycle testing to qualify for the automotive industry. Studies on the suitability of high-temperature thermoplastics as substrate materials for printed circuit boards and the qualification of QFN packages for advanced requirements are described. In addition, information on cause-effect relationships between thermal and vibration testing are given. Findings – With respect to adhesion of metallization on high-temperature thermoplastics and the long-term stability of the solder joints, these substrate materials offer potential for use in electronic devices for advanced requirements. In addition, the long-term stability of the solder joints of QFN packages depends on the design of the landings on the PCB and the separation process of the components during manufacturing. Research limitations/implications – The paper covers only a selection of possible high-temperature thermoplastic materials that can be used in electronics production. Also, this paper has a focus on the new packaging type, QFN, in the context of qualification and automotive standards. Originality/value – The paper details the requirements electronic devices have to meet to be qualified for the automotive industry. Therefore, this contribution has its value in giving information on possible substrate alternatives and the suitability for the usage of QFN components for highly stressed electronic devices.en
dc.identifier.citationCircuit World 34.3 (2008): S. 23-30. 28.01.2013 <http://www.emeraldinsight.com/journals.htm?issn=0305-6120&volume=34&issue=3&articleid=1742106>
dc.identifier.opus-id2904
dc.identifier.urihttps://open.fau.de/handle/openfau/2904
dc.identifier.urnurn:nbn:de:bvb:29-opus-41406
dc.language.isoen
dc.subjectAutomotive industry
dc.subjectElectronics industry
dc.subjectSoldering
dc.subjectTests and testing
dc.subject.ddcDDC Classification::6 Technik, Medizin, angewandte Wissenschaften :: 60 Technik :: 600 Technik, Technologie
dc.titleReliability aspects of electronic devices for advanced requirementsen
dc.typearticle
dcterms.publisherFriedrich-Alexander-Universität Erlangen-Nürnberg (FAU)
local.journal.titleCircuit World 34.3 (2008): S. 23-30. 28.01.2013 <http://www.emeraldinsight.com/journals.htm?issn=0305-6120&volume=34&issue=3&articleid=1742106>
local.sendToDnbfree*
local.subject.fakultaetTechnische Fakultät / Technische Fakultät -ohne weitere Spezifikation-
local.subject.gnd-
local.subject.sammlungUniversität Erlangen-Nürnberg / Nationallizenzen: Alle Beiträge sind mit Zustimmung der Rechteinhaber aufgrund einer DFG-geförderten Nationallizenz frei zugänglich. / Nationallizenzen 2008
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